Thermostructural Characterization of Silicon Carbide Nanocomposite Materials via Molecular Dynamics Simulations
Author:
Ortiz-Roldan, Jose-Manuel; Montero Chacón, Francisco
; García-Pérez, Elena; Calero, Sofia; Ruiz-Salvador, A. Rabdel
ISSN:
0924-3046DOI:
10.1080/09243046.2021.2001988Date:
2021-12-21Abstract:
In this paper, we investigate the thermostructural properties of a type of silicon-based nanomaterials, which we refer to as SiC@Si nanocomposites, formed by SiC crystal line nanoparticles (with the cubic phase), embedded within an amorphous Si matrix. We have followed an in silico approach to characterize the mechanical and thermal behaviour of these materials, by calculating the elastic constants, uniaxial stress-strain curves, coefficients of thermal expansion, and specific heats, at different tempera tures, using interatomic potential calculations. The results obtained from our simula tions suggest that this type of material presents enhanced thermal resistance features, making it suitable to be used in devices subjected to big temperature changes, such as heat sinks in micro and nanoelectronics, solar energy harvesters at high temperatures, power electronics, or in other applications in which good thermomechanical proper ties are required.
In this paper, we investigate the thermostructural properties of a type of silicon-based nanomaterials, which we refer to as SiC@Si nanocomposites, formed by SiC crystal line nanoparticles (with the cubic phase), embedded within an amorphous Si matrix. We have followed an in silico approach to characterize the mechanical and thermal behaviour of these materials, by calculating the elastic constants, uniaxial stress-strain curves, coefficients of thermal expansion, and specific heats, at different tempera tures, using interatomic potential calculations. The results obtained from our simula tions suggest that this type of material presents enhanced thermal resistance features, making it suitable to be used in devices subjected to big temperature changes, such as heat sinks in micro and nanoelectronics, solar energy harvesters at high temperatures, power electronics, or in other applications in which good thermomechanical proper ties are required.


